Printed Circuit Board Production Capacity
Production product range
4-28 layers of high-precision impedance, multi-layer blind burial, HDI board, high-frequency board, halogen-free board, high TG board, aluminum-based, copper-based, iron-based and ceramic-based circuit boards, 1-6 layers of flexible circuit boards ( FPC) and soft-hard combination flexible boards and other high-tech products.
Rigid PCB circuit board process capabilities
Number of processing layers: 1-28 layers
Finished plate thickness (thinnest - thickest): 0.008″~0.24″ (0.20mm~6.0mm)
Minimum aperture: 6mil (0.15mm)
Minimum line width/space: 3-4 mil (0.076-0.10mm)
Maximum board size: single and double layer 22″x 43″ (550 x1100mm) multi-layer board 22″x 25″ (550mm x 640mm)
Impedance control: ±10%
Surface treatment process: Anti-oxidation OSP, spray tin, electroless nickel/gold, chemical nickel/gold, lead-free spray tin, gold finger, immersed silver, immersed tin, thick nickel/gold;
Processing materials: FR4 (Shengyi, KB, International), high TG (TG150, TG170), halogen-free plate, high-frequency plate (Rogers, Teflon, Taconic), domestic polytetrafluoroethylene (F4B, F4BK), aluminum Substrate (Berquist, domestic Al-based), copper-based, iron-based, ceramic substrate;
Flexible FPC circuit board process capabilities
Number of processing layers: 1-6 layers
Finished board thickness (thinnest): 3mil (0.08mm)
Minimum aperture: 4mil (0.10mm)
Minimum line width/space: 2 mil (0.05mm)
Maximum board size: 10" x 45" (250x 1200mm)
Surface treatment process: anti-oxidation OSP, spray tin, electro-nickel/gold, chemical nickel/gold, lead-free spray tin, immersion gold;
Insulation resistance: ±1011Ω (Normal)
Thermal shock resistance: 260℃ for 10 seconds
Processing materials: polyimide (PI), polyester (PET), polyimide (PI) + FR4
PCB Production Video