General appearance inspection specification for PCBA
1.Solder joints: The wetting angle between the fillet weld with poor contact angle and the land pattern end joint is greater than 90°.
2.Upright: One end of the component leaves the pad and stands up obliquely or upright.
3.Short circuit: The solder between two or more solder joints that should not be connected is connected, or the solder of the solder joint is connected to adjacent wires.
4.Empty soldering: that is, the lead pins of the components and the solder joints of the PCB are not connected by solder.
5.False soldering: The component lead and the PCB solder joint seem to be connected, but they are not actually connected.
6.Cold welding: The solder paste at the solder joint is not completely melted or a metal alloy is not formed.
7.Less tin (insufficient tin consumption): The area or height of tin consumption at the component end and the PAD does not meet the requirements.
8.Too much tin (too much tin): The area or height of tin between the component end and the PAD exceeds the requirements.
9.Blackening of solder joints: The solder joints are black and dull.
10.Oxidation: The surfaces of components, circuits, PADs or solder joints have undergone chemical reactions and have colored oxides.
11.Shift: The component deviates from a predetermined position in the lateral (horizontal), longitudinal (vertical) or rotational direction in the plane of the pad (based on the centerline of the component and the centerline of the pad).
12.Reverse polarity (reverse): The direction or polarity of the polarized components does not conform to the requirements of the documents (BOM, ECN, component location diagram, etc.)
13.Floating height: There is a gap or height between the component and the PCB.
14.Wrong parts: The specifications, models, parameters, shapes and other requirements of the components are inconsistent with (BOM, samples, customer information, etc.).
15.Tin tip: The solder joint of the component is not smooth and there is a sharp tip.
16.Multiple pieces: According to the BOM, ECN or template, etc., there are multiple pieces in the position where the parts should not be attached or if there are redundant parts on the PCB.
17.Missing parts: According to BOM, ECN or template, etc., the position of the parts that should be installed or the parts on the PCB but not the parts are all less parts.
18.Dislocation: The position of the component or component foot is moved to the position of other PAD or foot.
19.Open circuit (open circuit): PCB circuit disconnection phenomenon.
20.Side laying (side standing): The sheet-like components with different width and height are placed on the side.
21.Inverted (turned over): The two symmetrical faces of the components with different positions are interchanged (for example: the face with silk screen logo and the face without silk screen logo are reversed upside down), chip resistors are common.
22.Tin beads: small tin spots between component feet or outside the PAD.
23.Air bubbles: There are air bubbles inside solder joints, components or PCBs.
24.Tin (climbing tin): The height of the solder joints of the components exceeds the required height.
25.Tin crack: The solder joint is cracked.
26.Hole plug: PCB plug-in holes or via holes are blocked by solder or other.
27.Damage: There are cracks, cuts, or damage to components, bottoms, surfaces, copper foils, circuits, through holes, etc.
28.Blurred silk screen: The text or silk screen of components or PCB is blurred or broken, which cannot be recognized or blurred.
29.Dirty: the board surface is not clean, there are foreign objects or stains and other defects.
30.Scratches: scratches on PCB or buttons and exposed copper foil.
31.Deformation: Components or PCB bodies or corners are not on the same plane or bent.
32.Blistering (layering) PCB or components are layered with copper and platinum, and there is a gap.
33.Glue overflow (too much glue) (too much red glue) or overflow requirement range.
34.Less glue (the amount of red glue is too little) or does not meet the required range.
35.Pinholes (concave points): PCBs, PADs, solder joints, etc. have pinhole concave points.
36.Burr (Phifeng): The edge or burr of the PCB board exceeds the required range or length.
37.Gold finger impurities: There are abnormalities such as pitting, tin spots or solder mask oil on the surface of the gold finger plating.
38.Gold finger scratches: There are scratches or exposed copper and platinum on the surface of the gold finger plating.
